Artemis - Stacked Version - Board Layout Review

[MantaRayDeeJay]

_Review Status : Finished

GLOBAL

Schematic

• ESD Protection behind the USB connector should be implemented.
• I think I2C_RTC chip, I2C_IO_expander chip and I2C_Pull-up resistors should be powered by the same 3v3_I2C power.
• Rename Vbat label by bat+ on the "Battery Protection" sheet to improve reading and avoid any confuse.

Layout

• Improve ESP32 Antenna clearance area. (See comments on Apollo board Review Ticket)
• Track loop : Disconnect GND tracks between C11&18 and C10&C16. In this way each "capacitor" group can have a unique link to the ground area by their own VIA.
• Track loop : Disconnect GND track between U2.2 and U2.3 pins.
• Track loop : Disconnect some 3v3_I2c tracks and increase some 3v3_I2c tracks width.
• Track over plane : Remove the Vbat track which is over the Vbat Plane shape.
• Plane shape : Improve Vbat- plane shape layout.
• Plane shape : Improve Vbat+ plane shape layout.
• Plane shape : Improve Inductor L1 plane shapes + Add a GND shield Plane shape
• Clock Signal : Improve Clearance for the CLK pin of the FLASH chip.
• I2C bus : Check CLK and Data signal tracks (Improve clearance from others nets as do as possible)
• Remove Mouting Holes copper area in the ESP32 Antenna clearance area.

DRC Issues

• Solve GND MouTinG Holes issue. (Hole and Pad size can't be the same if you plan to connect the Mtg Hole to a net)

SilkScreen

• Ref. Des. string Overlap the copper layer
• Remove Mouting Hole Ref. Des. String on SilkSreen layer
• Replace "Artemis" string by "ESP32" on ESP32 board.

3D Package

• Check File links and 3D files presence for the following packages : SOIC-8, SOP-8, SOP-16, Inductor (L1), Micro-USB and Tactile Switches.

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DETAILS

Schematic

• I2C chips (except for the LC709203 fuel gauge) and I2C Pull-Up resistors should should be powered by the same 3v3_I2C power.
  

• Rename Vbat label by bat+ on the "Battery Protection" sheet to improve reading and avoid any confuse.
  

Layout

• ESP32 Antenna clearance

DRC Issues

• "GND" MouTinG Holes issue
  

• Track loop : GND tracks between C11&18 and C10&C16
  

• Track loop : GND track between U2.2 and U2.3 pins.
  

• Track loop : Disconnect some 3v3_I2c tracks and increase some 3v3_I2c tracks width.
  

• Track over plane : Remove the Vbat track which is over the Vbat Plane shape.
  

• Plane shape : Improve Vbat- plane shape layout.
  

• Plane shape : Improve Vbat+ plane shape layout.
  (1) Path between Battery connector and TP4056 : Remove Loops and improve path width
  
  
  

(2) Utility of Bottom track bridge ? It adds loops, not needed.

(3) Power Path on the plane : From Battery connector to TP4056 charger chip, +5V, +3.3V and +3.3V_MCU regulators.

(4) Improve Regulator Power Path

• Plane shape : Improve Inductor L1 plane shapes + Add a GND shield Plane shape
  
  
  

• Clock Signal : Improve Clearance for the CLK pin of the FLASH chip.
  

• Remove Mouting Holes copper area in the ESP32 Antenna clearance area.
  

SilkScreen

• Ref. Des. string Overlap the copper layer
  

• Remove Mouting Hole Ref. Des. String on SilkSreen layer
  

• Replace "Artemis" string by "ESP32" on ESP32 board.
  

3D Packages

• Check File links and 3D files presence for the following packages : SOIC-8, SOP-8, SOP-16, Inductor (L1), Micro-USB and Tactile Switches.
  

[Tobi3566]

Some comments on the review points:
ESD: no low cost dev board that i know of has ESD on the usb input and this version is still kinda intended to be lowcost and possible to hand solder

U2: connected the same way basically all charger boards have the mosfet connected (some even have filled plane). also doesn't cause any electrical issues at all

VBat track width: not really possible with the layout and it is also sufficient for the expected current (slightly improved it already)

[MantaRayDeeJay]

@Tobi3566
ESD Protection: why and how to protect microcontrollers efficiently
https://www.youtube.com/watch?v=56eZHBBuvsk